DRY FILM LAMINATION AND PRINTING FOR PCB
A. Dry Film Lamination
Purpose: Applies a light-sensitive resist layer to the PCB surface for circuit pattern development.
• Process:
1. PCB panels are cleaned to remove oxidation.
2. A dry film resist (photosensitive polymer) is laminated onto the copper surface using heat and pressure.
3. The laminated panel is ready for UV exposure to define the circuit pattern.
B. Printing (Photoresist Exposure & Development)
Purpose: Transfers the circuit pattern onto the dry film for etching or plating.
• Process:
1. The panel is exposed with an automatic UV Laser system from the prepared Gerber files
2 The panel is developed in an alkaline or acid solution, removing unexposed resist.
This process ensures high-resolution circuit patterning, essential for fine-pitch and high-density PCBs.
