ELECTROLYTIC PLATING for PCBs
Electrolytic Plating (Electroplating)
Purpose: Increases copper thickness on traces and inside vias for durability and conductivity.
• Process:
1. The panel is submerged in an electroplating bath with a copper sulfate solution.
2. An electrical current is applied, attracting copper ions to the conductive areas.
3. Builds up the copper layer to the required thickness (typically 25-30 μm).
4. A final Tin or Gold thickness is applied to a etching protection on the next step.
This process ensures strong electrical connections and enhances PCB mechanical reliability.
