PCB DIRECT PLATING AND PCB PANEL PLATING
PCB Direct Plating or Direct Plated Copper (DPC)
Purpose: Deposits a conductive layer inside the drilled holes, enabling electrical connectivity of the all layers of the PCB.
Process:
1. Panels are placed in a horizontal chemical machine that applies a thin conductive layer of chemical copper
2. Ensures a uniform conductive surface for subsequent electroplating.
These steps are crucial for high-reliability PCB manufacturing, improving hole integrity and plating adhesion.
PCB Panel Plating
Purpose: Deposits a thick, conductive copper layer inside drilled holes and on the PCB surface using an automatic horizontal electroplating machine.
Process:
1. Panels are processed in an electroplating bath with a copper sulfate solution, for a deposition of a thick (5-7 μm) copper layer.
2. Ensures conductivity in drilled holes for further electroplating.
The choice between direct plating and panel plating depends on the specific PCB design requirements, including the complexity of the circuit, the desired level of precision, and cost considerations
