PRESS LAMINATION Process in PCB manufacturing
The press lamination process in PCB manufacturing involves bonding multiple layers of copper-clad laminates and insulating prepreg materials under controlled heat and pressure. The key steps are:
1. Layer Stacking – Inner core layers, prepreg (resin-infused fiberglass), and copper foil layers are aligned in a precise stack.
2. Layer alignement – The stack is held together using an automatic optical alignment systems before lamination.
3. Hot Pressing – The stack is placed in a multilayer vacuum press with controller thermal cycle. Special press is available for the fusion bonding process in order to build special pcb without prepreg for the high frequency applications.
4. Cooling & Curing – The press gradually cools to solidify the resin, ensuring a strong, void-free bond avoiding bow and twist.
5. Post-Lamination Processing – The laminated PCB panel is removed, and excess material is trimmed before drilling and further processing.
This process ensures high structural integrity, electrical performance, and reliability for multilayer PCBs used in advanced electronics.
