PLASMA AND DESMEARING process for PCB Panels
Chemical desmearing and Plasma Desmearing
Purpose: Removes resin smear (epoxy debris) from drilled holes, ensuring proper electrical connections between layers.
• Chemical Process:
1. PCB panels are placed in a horizontal chemical machine using permanganate base solution to etches away resin residues.
2. Enhances hole wall cleanliness for better metal adhesion during plating.
• Plasma Process:
1. PCB panels are placed in a vacuum chamber between RF electrodes.
2. A plasma treatment (using oxygen or fluorine-based gases) etches away resin residues.
3. Enhances hole wall cleanliness for better metal adhesion during plating.
