STRIPPING & ETCHING
A. Stripping (Resist Removal)
Purpose: Removes the dry film resist.
Process:
1. The PCB is immersed in a resist stripping solution (alkaline-based).
2. The remaining resist layer dissolves, exposing the copper traces.
B. Etching (Copper Removal)
Purpose: Removes excess copper, leaving only the desired circuit pattern on the PCB.
Process:
1. The PCB (with developed dry film resist or with a tin or gold protection after plating) is placed in an etching bath (usually ammoniacal or ferric chloride solution).
2. The chemical solution dissolves unwanted copper, exposing the traces protected by the resist.
3. Ensures precision in trace width and spacing.
This phase ensures the correct circuit pattern formation, essential for proper PCB functionality.
